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01Upstream raw material application test and comprehensive evaluation
Glass fiber cloth, copper foil, resin, filler, solvent, various additives, etc.
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02Research on Resin for Electronic Circuit Base Material
Resin prefabrication
Functional resin modification
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03Filler application research
Tiánliào biǎomiàn chǔlǐ 6/5000 Filler surface treatment
Filler formulation research
Preparation of ultrafine filler dispersion
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04Electronic circuit substrate formulation design
Resin composition formulation design for electronic circuit substrate
Study on resin curing mechanism
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05High-quality bonding sheet manufacturing capability
Manufacture of adhesive sheets covering various CEM-3 and FR-4
Meet all kinds of electronic grade glass fiber cloth, the thinnest can meet
Manufacturing of 1017 model ultra-thin bonding sheet
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06High-precision coating capability, various metal foils
Coating viscosity can be 100 to 40,000 cP
Coating thickness is 2 to 150 um
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07層壓能力
Mass production of panels up to 43×49 inch
Provide lamination temperature control up to 400 ℃, maximum surface pressure
120 kg/cm pressure control
400 ℃ high temperature roller press
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08Systematic copper clad laminate engineering technology development
Process route and control parameter design
Manufacturing equipment improvement and upgrade
Energy saving and consumption reduction program design
System solution
