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01Upstream raw material
application test and
comprehensive evaluationGlass fiber cloth, copper foil, resin, filler, solvent, various additives, etc.
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02Research on Resin for
Electronic Circuit Base MaterialResin prefabrication
Functional resin modification
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03Filler application research
Tiánliào biǎomiàn chǔlǐ 6/5000 Filler surface treatment
Filler formulation research
Preparation of ultrafine filler dispersion
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04Electronic circuit
substrate formulation designResin composition formulation design for electronic circuit substrate
Study on resin curing mechanism
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05High-quality bonding
sheet manufacturing capabilityManufacture of adhesive sheets covering various CEM-3 and FR-4
Meet all kinds of electronic grade glass fiber cloth, the thinnest can meet
Manufacturing of 1017 model ultra-thin bonding sheet
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06High-precision coating
capability, various metal foilsCoating viscosity can be 100 to 40,000 cP
Coating thickness is 2 to 150 um
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07Lamination ability
Mass production of panels up to 43×49 inch
Provide lamination temperature control up to 400 ℃, maximum surface pressure
120 kg/cm pressure control
400 ℃ high temperature roller press
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08Systematic copper clad laminate
engineering technology
developmentProcess route and control parameter design Manufacturing equipment improvement and upgrade Energy saving and consumption reduction program design System solution

